Thin-Film Encapsulation (TFE) Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2018 - 2028
Thin-Film Encapsulation (TFE) Market - Snapshot
The technique utilized in Organic Light Emitting Diodes (OLED) is thin-film encapsulation (TFE). With a thin-film barrier, TFE can replace front glass in OLED devices. OLEDs are being hailed as the next-generation display technology as the number of wearable gadgets grows. Thin-Film Encapsulation (TFE) has appeared as the most promising method for protecting these flexible electronics and thus the global thin-film encapsulation (TFE) market is likely to observe considerable growth.
Thin-film encapsulation refers to a multi-layer film made up of shifting inorganic as well as organic layers. Furthermore, each element in the thin-film encapsulation is physically, chemically, and mechanically tuned to assure the OLED device's long-term viability and prevent any damage. Thin-film encapsulation is difficult to design in terms of material design, therefore research is continuing to improve both inorganic as well as organic materials, and the deposition method as well.
Use of Thin-film in Flexible and Organic Devices to Boost Demand in the Market
The requirement for thin-film barriers in organic as well as flexible devices, the tendency of thin-film encapsulation employing inkjet printing technology, the growing utilization flexible OLED displays for smartphones and smart wearables are all driving the growth of the global TFE Market. Besides, the benefits of thin-film encapsulation are likely to augur well for the market.
The need for high-end OLED display technology in wearable devices is being driven by the tendency towards wearable technology. Because of its protection from other polluted materials, water-resistant characteristics, mechanical flexibility, water-resistant characteristics, and improved performance, OLED display manufacturers are using thin-film encapsulation (TFE). With smartwatches, smartphones, and other smart wearable devices adopting flexible device structures, thin-film encapsulation is anticipated to find widespread use in these devices.
In addition to that, metal oxide thin films such as zirconium oxide, aluminum oxide, and titanium oxide produced via atomic layer deposition have gained appeal as thin-film encapsulating materials. Experts have lately recommended combining molecular layer disposition (MLD) and atomic layer disposition (ALD) structures due to the good film integrity in these multi-layers, resulting in improved thin-film encapsulation performance.
Thin-Film Encapsulation (TFE) Market Introduction
Thin-Film Encapsulation (TFE) is the technology used in Organic Light Emitting Diodes (OLED). TFE can replace front glass in OLED devices with thin-film barrier. With the rise in wearable devices, OLEDs are considered as next-gen display technology. In order to protect these flexible devices, Thin-Film Encapsulation (TFE) has emerged as the most promising technology.
Thin-Film Encapsulation is based on the multi-layer film, made of altering inorganic and organic layers. Moreover, each and every component in thin-film encapsulation is mechanically, chemically, and physically optimized in order to ensure long-life of the OLED device and avoid any damages. In terms of material design, Thin-Film Encapsulation is very challenging, thus, research activities are ongoing with an aim to optimize both inorganic and organic materials and the deposition process.
Thin-Film Encapsulation (TFE) Market- Notable Highlights
Founded in 1970, Samsung SDI is located in South Korea. The company offers small size lithium-ion batteries used in consumer electronics, petrochemicals, resin materials, semiconductor products, LCD products, OLED products including thin-film encapsulation materials.
Founded in 1947, LG Chem is located in South Korea. The company provides energy solutions, advanced materials including display, automotive, and semiconductor materials, and life science products including vaccines, fine chemicals and pharmaceutical products.
Universal Display Corp.
Founded in 1994, Universal Display Corp. is located in the US. The company provides materials used in the flat panel displays and solid state lighting application. It is also in the research, development and commercialization of OLED technologies.
Founded in 1967, Applied Materials is located in the US. The company provides material engineering solutions for the flat panel display, semiconductor, and solar photovoltaic industry.
Leading players in the thin-film encapsulation (TFE) market are Toray Industries, Meyer Burger, BASF (Rolic), Veeco Instruments, AMS Technologies, Aixtron, Bystronic Glass, and Angstrom Engineering.
Thin-Film Encapsulation (TFE) Market Dynamics
Increasing Adoption of Flexible OLED Display Technology for Smart Wearables
Inclination of trend towards wearable technology is driving the demand for high-end OLED display technology in wearable devices. This driving the adoption of thin-film encapsulation (TFE) by OLED display manufacturers owing to its mechanical flexibility, superior performance, water-resistant properties, and protection from other contaminated elements. With the adoption of flexible device structure by smartphones, smartwatch, and other smart wearable devices, the Thin-film encapsulation is likely to find major applicability in these devices.
Moreover, in terms of thin-film encapsulation materials, metal oxide thin films such as titanium oxide, aluminum oxide, and zirconium oxide grown using atomic layer deposition has gained popularity. Meanwhile, recently, atomic layer disposition (ALD) and Molecular Layer Disposition (MLD) combination structure has been suggested by experts, because of the good film integrity in these multilayers, resulting in the advanced performance for thin-film encapsulation.
Inkjet Printing Technology Gaining Popularity in OLED Thin-Film Encapsulation (TFE) Market
Inkjet printing technology providing flexible and large-size OLEDs is gaining popularity in the thin-film encapsulation (TFE) market. Manufacturers are focusing on developing novel inkjet printing technology to attract OLED display manufacturers and to simplify development of OLED display. The key focus area of manufacturers of thin-film encapsulation to provide inkjet printing to reduce the overall cost of manufacturing OLED devices and provide flexibility and thinness.
With inkjet printing technology emerging as the prevailing trend in the thin-film encapsulation (TFE) market, manufacturers are focusing on developing new inkjet printing technology and are also receiving orders for thin-film encapsulation (TFE) systems. For instance, in 2017, Meyer Burger shipped its CONx TFE OLED system which included two deposition technologies, remote plasma PECVD and inkjet printing technology.
Development of Flexible Glass to Challenge Thin-Film Encapsulation (TFE) Market Growth
For decades, glass has been an excellent barrier, offering high dimensional stability and processing temperatures. Manufacturers are also developing flexible glass targeting the display industry. Moreover, manufacturers have also overcome numerous challenges in glass for display with major issues such as bendability and difficulty in handling.
In recent years, bendability of glass has significantly improved due to the use of the combination of embedding ions along with chemical cleaning of the surface and edges. Meanwhile, in terms of improving handling, edge tapes are being added to flexible glass. Nowadays, laser cutting process of glass also helps in avoiding cracks or stress. Edging towards the commercialization with flexible glass, manufacturers are also offering wide format glass for large screen displays.
Thin-Film Encapsulation (TFE) Market Segmentation
Based on the technologies, the thin-film encapsulation (TFE) market is segmented into
Based on the application, the thin-film encapsulation (TFE) market is segmented into
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