Flex and Flex-Rigid Printed Circuits Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 - 2025
In the last few years, North America and Europe have been extremely benefitted by the overflowing demand for flex and flex-rigid printed circuits. In these regions, aerospace and military have been the backbone of their production of flex and flex-rigid printed with maximum consumption. The demand for flexible and flex-rigid printed circuits has been incessantly rising use of televisions, monitors, notebooks, LCD and plasma displays, digital cameras, and mobile phones.
One of the leading employers of flex and flex-rigid printed circuits is the medical sector which has been using it for many years now. It uses flex and flex-rigid printed circuits in several applications namely large imaging equipment, defibrillators, pacemakers, and hearing aids. The market is also expected to flourish owing to the emergence of Internet of Things (IoT). With the rising penetration of consumer electronics, the application array of flex and flex-rigid printed circuits has also increased in the automotive industry. Thus, this also expected to support the growth of the global flex and flex-rigid printed circuits market.
Players operating in the global flex and flex-rigid printed circuits market are focusing on technological advancements and innovation for establishing a firm grip on the market in the near future. Innovation in the products available is the key strategy that can help the market leaders prosper in the coming future and grasp a strong consumer base.
The global flex and flex-rigid printed circuits market is undergoing a transitional phase. The growing demand for these circuits, fueled by their increased popularity, owing to their reliability as they take out interface connections, such as connectors and solders joints and also have a cost saving factor since only a few parts are required for the final assembled product, is adding significantly to the growth of this flex and flex-rigid printed circuits market. The heat dissipating capacity of flex and flex-rigid printed circuits, enabling them to be deployed in extreme temperature applications are also expected to support this flex and flex-rigid printed circuits market substantially in the coming years.
The worldwide flex and flex-rigid printed circuits market is heavily influenced by the escalating demand for high-end digital cameras, mobile phones, and flat panel displays. These circuits resolves the three dimensional structural issues outperforming the printed circuit board technology deployed in rigid boards, cables, and connectors. In mobile phones, the camera module interconnect, sliding-opening mechanisms, and the display and battery module interconnect is made possible by the implementation of flexible circuits while in digital cameras, the image sensor and the display modules are mounted on a circuit board, which requires flexible interconnections.
In flat panel displays, flexible printed circuits enables increased pixel count and routing density, required for enhancing display quality. However, this mechanism is extremely difficult to handle in production procedures. The mechanical stress put on these materials by various methods can have an effect on their accuracy, reliability, and burr formation.
The global flex and flex-rigid printed circuits market is majorly analyzed on the basis of the type of the flex and the circuit and its architecture. Single layer flex circuit, double sided flex circuit, multi-layer flex circuit, andrigid-flex circuit are the main types of flex circuits available in this market.The single layer flex circuit possesses a single conductive layer, which is either uncovered on one side or is bonded between two insulating layers. The double sided flex circuit possesses two conductive layers with an insulating layer in the middle. In such type of flex circuit,the outer layers are either covered or exposed.
The multi-layer flex circuits have three or more flexible conductingand insulating layers between each other and the outer layers are either covered or are exposed. It is very much possible to implement controlled impedance in this type of architecture. The rigid-flex circuit have two or more conductive layers with either a rigid or flexible insulation material as insulators in the mid.
Motorola Inc., Samsung Group, Nokia Oyj, Sony Mobile Communications AB, Toshiba Corp., Agilent Technologies, and Epec LLC are some of the leading players in the global flex and flex-rigid printed circuits market.
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